Data card and method of manufacturing same

H - Electricity – 05 – K

Patent

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H05K 1/18 (2006.01) G06K 19/077 (2006.01) H01L 21/60 (2006.01) H01L 23/14 (2006.01) H01L 23/538 (2006.01) H05K 3/30 (2006.01)

Patent

CA 1203634

ABSTRACT: A data card comprising a lower covering foil (2), a card body (3) and an upper covering foil (1), in which the card body (3) a carrier body (4) is present which is provided on one or both sides with conductor tracks (11, 12) and carries a semiconductor chip (5). In order to be able to contact the semiconductor chip (5) by means of conventional wire connections (7) and never- theless not to exceed a thickness of 0.76 mm for the card, the carrier body (4) has the form of a foil which is provided with a perforation (10) and in which the semicon- ductor chip (5) is disposed in the perforation (10) and is surrounded on the upper side of the carrier body (4) by a frame (8) and is covered with a covering mass (9). In the manufacture of such a card, the carrier body (4) provided with a perforation (10) is first covered on its lower side with a preferably self-adhering foil (6), to which the semiconductor chip (5) is then adhered, while this foil (6) is removed after the frame (8) and the covering mass (9) have been provided.

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