C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 5/10 (2006.01) B05D 1/28 (2006.01) B29C 70/60 (2006.01) C08K 5/13 (2006.01) C08L 27/06 (2006.01) C08L 33/06 (2006.01) C08L 101/00 (2006.01) C09D 127/06 (2006.01) D06N 3/06 (2006.01) D06N 3/08 (2006.01) D06N 7/00 (2006.01) C08L 33/10 (2006.01) C08L 61/28 (2006.01)
Patent
CA 2129025
2129025 9315135 PCTABS00024 Disclosed are compositions comprising carrier, first organic polymeric material fused or fusible in said carrier and second polymeric material not fusible in said carrier, said second polymeric material having a softening point temperature which is less than about the fusion temperature of said first polymeric material in the plasticizer, and preferably within about the gelation temperature range of said first polymeric material in said carrier. It is preferred that the first polymeric material comprise vinyl resin and that the second polymeric material comprise polymer particles. Also disclosed are methods for producing surface coverings and surface covering compositions comprising converting the liquid compositions of the present invention to the solid compositions hereof under time and temperature conditions sufficient to enable softening, and preferably substantial softening and swelling, of the second polymeric material prior to fusion, and preferably during gelation, of the liquid composition.
Dixon Ronald
Morselander Eugene
Shalov Allen A.
Borden Ladner Gervais Llp
Congoleum Corporation
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