Deformable integrated circuit chip carrier

Details Deformable integrated circuit chip carrier Deformable integrated circuit chip carrier

H - Electricity

05

K

356/3

H05K 1/18 (2006.01) H01L 23/057 (2006.01) H01L 23/13 (2006.01) H01L 23/14 (2006.01) H01L 23/367 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H05K 3/34 (2006.01) H05K 7/20 (2006.01) H05K 1/02 (2006.01) H05K 3/00 (2006.01) H05K 3/24 (2006.01) H05K 3/40 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1237533

ABSTRACT A chip carrier is disclosed which includes a body having a central region and sidewalls connected to the central region by an elastically deformable region, in order to reduce thermal strains. Also for the same reason a heat sink may be attached underneath the carrier below the carrier's die attachment site and thermally conductive material may connect them together. The heat sink may be used for mechanical anchorage. The chip carrier can be produced by injection moulding from an aromatic thermoplastic polymer. A carrier may be moulded with more than one die attachment site or a circuit board with die attachment sites could be moulded, preferably with the die attachment site recessed so that the surface of the die is co-planar with conductive tracks on the board.

481872

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