Deformation resistant shielding composition

C - Chemistry – Metallurgy – 09 – K

Patent

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31/158, 18/771

C09K 3/00 (2006.01) C08K 3/04 (2006.01) C08L 23/08 (2006.01) H01B 1/24 (2006.01) H01B 3/00 (2006.01) H01B 3/44 (2006.01) H01B 9/02 (2006.01) H01F 1/10 (2006.01)

Patent

CA 1046266

DEFORMATION RESISTANT SHIELDING COMPOSITION ABSTRACT OF THE DISCLOSURE A deformation resistant semi-conducting composition is formed from low density thermoplastic ethylene copolymer, carbon black, thermoplastic crystalline high density ethylene polymer or propylene resin and a thermoplastic elastomer. The composition is useful as insulation shielding material or as conductor shielding material in high voltage wire and cable. S P E C I F I C A T I O N 1.

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