H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 27/146 (2006.01) H01L 21/77 (2006.01) H01L 31/18 (2006.01)
Patent
CA 2719684
A plurality of image sensor structures and a plurality of methods for fabricating the plurality of image sensor structures provide for inhibited cracking and delamination of a lens capping layer (22) with respect to a planarizing layer (18) within the plurality of image sensor structures. Particular image sensor structures and related methods include at least one dummy lens layer (20') of different dimensions than active lens layer (20) located over a circuitry portion (R1) of a substrate within the particular image sensor structures. Additional particular image sensor structures include at least one of an aperture (A) within the planarizing layer and a sloped endwall of the planarizing layer located over a circuitry portion (R1) within the particular image sensor structures.
Une pluralité de structures de capteurs dimage et une pluralité de procédé de fabrication de la pluralité de structures de capteurs dimage permettent dempêcher la fissuration et le décollement dune couche de recouvrement de lentilles (22) vis-à-vis dune couche de planarisation (18) au sein de la pluralité de structures de capteurs dimage. Des structures de capteurs dimage particulières et des procédés associés font appel à au moins une couche de lentilles factice (20') de dimensions différentes de celles dune couche de lentilles active (20) au-dessus dune partie de circuiterie (Rl) dun substrat au sein des structures de capteurs dimage particulières. Dautres structures de capteurs dimage particuliers comprennent une ouverture (A) au sein de la couche de planarisation et/ou une paroi dextrémité inclinée de la couche de planarisation au-dessus dune partie de circuiterie (Rl) au sein des structures de capteurs dimage particuliers.
Gambino Jeffrey P.
Jaffe Mark D.
Leidy Robert K.
Musante Charles F.
Rassel Richard J.
International Business Machines Corporation
Wang Peter
LandOfFree
Delamination and crack resistant image sensor structures and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Delamination and crack resistant image sensor structures and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Delamination and crack resistant image sensor structures and... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1472551