C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
117/31, 400/6406
C08L 57/00 (2006.01) B01J 13/14 (2006.01) C08J 3/12 (2006.01) C09J 5/00 (2006.01) C09J 7/02 (2006.01) C09J 7/04 (2006.01) C09J 133/08 (2006.01)
Patent
CA 1085988
ABSTRACT OF THE DISCLOSURE The present specification discloses a delayed-tack adhesive composition comprising in admixture particles of polymeric material having a soft polymeric core surrounded by a hard polymer shell and a solid modifier capable when melted of dissolving the hard polymeric shell. The specification also discloses a method of preparing a delayed-tack adhesive composition, comprising forming in a liquid a dispersion of particles of soft polymeric material, forming around each of the particles a shell of hard polymeric material, providing in the dispersion particles of a modifier capable when melted of dissolving the hard polymeric material, and removing the liquid at a temperature below the melting point of the modifier. The hard polymeric shell produces particles which are non-tacky and resistant to blocking when incorporated in the unactivated adhesive composition. On activation the modifier dissolves the shell and may also release the soft core polymer, whereby the advantages which are derived from the use of a soft polymer are obtained.
249430
Henderson Neil K.
Thomson Eric
Gowling Lafleur Henderson Llp
Smith & Mclaurin Limited
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