C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/18.6
C25D 5/56 (2006.01) C23C 18/20 (2006.01) H05K 1/03 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)
Patent
CA 1036533
DENSITY CONTROLLED ELECTROPLATING POLYMER COMPOSITIONS COMPRISING TWO FILLERS ABSTRACT OF THE DISCLOSURE A plastic composition especially suitable for use in barrel elec- troplating processes is prepared by incorporating in the plastic a siliceous filler and a heavy filler such as barium sulfate or zinc oxide in amounts such that the density of the molded composition is greater than the density of the plating bath.
200784
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