C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 33/10 (2006.01) A61K 6/00 (2006.01) A61K 6/08 (2006.01) A61K 6/083 (2006.01) A61L 24/04 (2006.01) C07F 5/02 (2006.01) C08F 2/38 (2006.01) C08F 4/44 (2006.01) C08J 5/12 (2006.01) C08L 33/06 (2006.01) C09J 133/10 (2006.01)
Patent
CA 2183040
A polymerization initiator composition comprising 100 parts by weight of an organic boron compound (A) and to 150 parts by weight of an aprotic solvent (B) having a boiling point of 30 to 150°C; and a dental or surgical adhesive composition containing the above polymerization initiator composition.
Arata Masami
Hashimoto Isao
Zeng Weiping
Smart & Biggar
Sun Medical Co. Ltd.
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