C - Chemistry – Metallurgy – 07 – C
Patent
C - Chemistry, Metallurgy
07
C
400/5105, 204/91
C07C 69/96 (2006.01) A61K 6/00 (2006.01) A61K 6/087 (2006.01) C09J 4/00 (2006.01)
Patent
CA 1309105
ABSTRACT OF THE DISCLOSURE A dental resin adhesive comprises BIS - GMA and a polycarbonate dimethacrylate of the formula Image A is C1 - C6 alkylene, R is C2 - C5 alkylene having at least 2 carbon atoms in its principal chain and n is an integer from 1 to 4. A method of bonding a dental restorative material to enamel, dentin, porcelain or metal includes applying to the surface of the material a curable resinous adhesive comprising from 25 to 35 percent of BIS - GMA and from 65 to 75 percent of the above-mentioned polycarbonate dimethylacrylate. The adhesive is cured and the dental restorative material placed on the adhesive.
505596
Pentron Corporation
Ridout & Maybee Llp
LandOfFree
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