B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
75/114, 6/36, 11
B23K 1/00 (2006.01) A61K 6/04 (2006.01) B23K 35/30 (2006.01) C22C 19/05 (2006.01)
Patent
CA 1066567
ABSTRACT OF THE DISCLOSURE The invention relates to dental solder particularly suitable for joining parts of structural frameworks made of non-precious metal alloys, the framework being used in the preparation of bridges, crowns and the like. The solder compositions consist essentially of about 69 to 75% nickel, about 14 to 19.9% chromium, about 4 to 5.5% silicon and about 2.5 to 6% boron. The composition may be modi- fied to include up to about 6% molybdenum to increase corrosion resistance. The solder has a fusion temperature in the range of from about 1800°F to about 1950°F and a diametrial tensile strength of at least 35,000 p.s.i. and a solder joint tensile strength of at least 70,000 p.s.i.
244966
Lee-You James
Sung Pei
LandOfFree
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