Deposited films with improved microstructures and methods...

C - Chemistry – Metallurgy – 23 – C

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204/96.06

C23C 14/50 (2006.01) C23C 14/00 (2006.01) C23C 14/22 (2006.01)

Patent

CA 1156968

K 03 RV-43P DEPOSITED FILMS WITH IMPROVED MICROSTRUCTURES AND METHODS FOR MAKING ABSTRACT OF THE DISCLOSURE Methods for improving microstructures of line-of-sight deposited films are described. Co- lumnar growth defects (228, 230) ordinarily pro- duced by geometrical shadowing during deposition of such films are eliminated without resorting to post-deposition thermal or mechanical treatments. The native, as-deposited coating qualities, includ- ing homogeneity, fine grain size, and high coat- ing-to-substrate adherence, can thus be retained. The preferred method includes the steps of emitting material from a source (124a) toward a substrate (200) to deposit a coating (201) non-uniformly on the substrate surface, removing a portion (212) of the coating uniformly over the surface, again depositing material (215) onto the surface, but from a different direction, and repeating the fore- going steps. The quality of line-of-sight depos- ited films such as those produced by sputtering, progressively deteriorates as the angle of inci- dence between the flux and the surface becomes increasingly acute. Depositing non-uniformly, so that the coating (201) becomes progressively thin- ner as quality deteriorates, followed by uniformly removing some of the coating, such as by resputter- ing, eliminates the poor quality portions (201b, 201c), leaving only high quality portions (201a, 201d) of the coating. Subsequently sputtering from a different direction applies a high quality coat- ing to other regions of the surface. Such steps can be performed either simultaneously or sequen- tially to apply coatings (350, 360) of a uniformly high quality, closed microstructure to three-di- mensional or large planar surfaces.

373474

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