Deposition of conductive metal by solution process

Details Deposition of conductive metal by solution process Deposition of conductive metal by solution process

C - Chemistry, Metallurgy

23

C

117/110, 6/4

C23C 30/00 (2006.01) B05D 3/02 (2006.01) C23C 20/04 (2006.01)

Patent

CA 2037808

AST 5538 DEPOSITION OF CONDUCTIVE METAL BY SOLUTION PROCESS ABSTRACT OF THE DISCLOSURE Thin metal films can be formed on a substrate by first coating the substrate with a solution comprising a solubilized metal source (e.g., copper) and a reducing alcohol (e.g., an alkoxyalcohol, an aminoalcohol), drying of the film solution to form a dried film, and heating of the film to reduce the metal to its elemental form.

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