Deposition of copper with spacing bodies between cathode and...

C - Chemistry – Metallurgy – 25 – C

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204/136, 204/68

C25C 1/12 (2006.01) C25C 7/00 (2006.01) C25C 7/04 (2006.01)

Patent

CA 1186274

ABSTRACT OF THE DISCLOSURE The disclosure describes a method for the elec- trolytic separation of metals particularly copper, in which, at the beginning of the electrolytic separation, cathode sheets, particularly thin starting cathode sheets are in- serted between anodes in the electrolytes, The cathode sheets are spatially fixed in the electrolyte. The apparatus is characterized by the fact that at least on one side of the cathode, punctiform spacing bodies are arranged, which abut on the cathode surface. This apparatus decreases the expen- diture necessary with the known mounting, permits the utili- zation of the entire cathode surface and beyond this is suit- able particularly with thin cathode plates which for example permit that a thin layer on a starting sheet likewise elec- trolytically deposited, which was subsequently removed from the starting sheet, be utilized as cathode sheet. Thereby, the volume -- time output and the current output can be in- creased as well as the use of energy diminished.

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