Deposition of silver layer on nonconducting substrate

Details Deposition of silver layer on nonconducting substrate Deposition of silver layer on nonconducting substrate

C - Chemistry, Metallurgy

23

C

117/79

C23C 18/30 (2006.01) A61L 27/00 (2006.01) A61L 29/00 (2006.01) A61L 29/10 (2006.01) A61L 29/16 (2006.01) A61L 31/00 (2006.01) C23C 18/44 (2006.01)

Patent

CA 2016081

Metallic silver is deposited upon the surface of a nonconducting substrate using a multi-step wet deposition process. The surface is cleaned, and then activated in an aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt, a reduction agent that reduces the salt to form the metallic silver, and a deposition control agent that prevents the silver from nucleating throughout the solution. After the substrate is coated, the coating is stabilized in an aqueous solution of a salt of a metal from the platinum group or gold, dissolved in dilute hydrochloric acid. The process is particularly effective for depositing uniform films of 2 to 2000 Angstroms thickness, which strongly adhere to the substrate.

De l'argent métallique est déposé à la surface d'un substrat non conducteur par un procédé de déposition humide multi-étapes. La surface est nettoyée, puis activée dans une solution aqueuse contenant de l'étain stanneux. L'argent est déposé sous forme de matière colloïdale à partir d'une solution aqueuse d'un sel argentifère, d'un agent qui réduit le sel pour former l'argent métallique, et d'un agent de régulation du dépôt, qui empêche l'argent de précipiter dans la solution. Après enrobage du substrat, le revêtement est stabilisé dans une solution aqueuse d'un sel de métal du groupe du platine ou d'or, dissous dans de l'acide chlorhydrique dilué. Le procédé est particulièrement efficace pour déposer des pellicules uniformes de 2 à 2000 angströms d'épaisseur, qui adhèrent fortement au substrat.

Affiliated with

Also associated with

Rating

Deposition of silver layer on nonconducting substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Deposition of silver layer on nonconducting substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Deposition of silver layer on nonconducting substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1930914