Deposition process

Details Deposition process Deposition process

G - Physics

11

B

96/254

G11B 5/31 (2006.01) G03F 7/00 (2006.01) H01F 41/34 (2006.01) H05K 3/04 (2006.01)

Patent

CA 1198308

ABSTRACT OF THE DISCLOSURE A desired feature is produced on a substrate by forming an adhesion inhibitor on the substrate adjacent the bounds of the feature being produced. A seedlayer is deposited over the adhesion inhibitor and exposed portions of the substrate, and a mask is formed over the seedlayer adjacent the edges of the adhesion layer to define the feature being produced. A deposition material is deposited over the exposed seedlayer, and the mask is removed. Unwanted portions of the seedlayer and deposition layer are removed by lifting off. The adhesion inhibitor is removed, either by lifting off with the seedlayer and deposition layer, or subsequently. The invention is particularly useful for the deposition forming thin film magnetic recording heads, and especially for the deposition of full wafers as opposed to individual small islands of pattern features.

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