C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 14/02 (2006.01) C23C 14/20 (2006.01)
Patent
CA 2710371
The deposition process comprises the following phases: placing a substratum to be covered in a deposition environment in which the deposition pressure is lower than the atmospheric pressure; applying a coating of metal material in the nebulized state onto said substratum to be covered, so as to obtain a covered substratum, being provided that said substratum to be covered is purified.
La présente invention concerne un procédé de dépôt qui consiste à : placer un substrat à recouvrir dans un environnement de dépôt dans lequel la pression de dépôt est inférieure à la pression atmosphérique; appliquer un revêtement de matériau métallique dans l'état nébulisé sur ledit substrat à recouvrir de façon à obtenir un substrat recouvert, à condition que ledit substrat à recouvrir soit purifié.
Girardello Gianpaolo
Mi Piaci S.r.l.
Norton Rose Or S.e.n.c.r.l. S.r.l./llp
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