Deposition processes

Details Deposition processes Deposition processes

C - Chemistry, Metallurgy

25

D

204/97.01

C25D 13/06 (2006.01) B05D 3/10 (2006.01) C08J 7/06 (2006.01) C09D 5/44 (2006.01) C25D 13/10 (2006.01)

Patent

CA 1275638

ABSTRACT Water insoluble resin additives are incorporated into electrophoretic resin films by immersing the uncured resin film after deposition but before curing in a solution of the additive in solvent medium comprising water and a water miscible organic solvent. The composition of the solvent medium is controlled so as to ensure that the additive is absorbed into the film without damage to the integrity of the film. In a preferred embodiment the solvent medium comprises a hydrotrope which enables the proportion of solvent in the reaction medium to be reduced.

481037

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