Desmear and etchback of printed circuit boards using an...

Details Desmear and etchback of printed circuit boards using an... Desmear and etchback of printed circuit boards using an...

H - Electricity

05

K

204/96.05

H05K 3/00 (2006.01) C09K 13/08 (2006.01)

Patent

CA 1336273

The present invention is directed to a method for desmearing printed circuit boards using a plasma gas desmearing medium produced between a pair of electrodes in an evacuated chamber wherein the material being desmeared is selected from the group consisting of epoxy and polyimide. The method comprises desmearing with a plasma comprising a gas mixture of 20-45% NF3 the remainder being O2 wherein the chamber is evacuated to a pressure in the range of 1000 to 3000 milli-Torr, and wherein the power density used to create the plasma is in the range of 0.08 to 0.25 watt/cm2.

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