Device and device manufacture method

H - Electricity – 01 – L

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Details

H01L 21/02 (2006.01) B23K 20/00 (2006.01) H01L 23/02 (2006.01) H01L 27/14 (2006.01) H01L 31/02 (2006.01)

Patent

CA 2704610

A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.

L'invention porte sur un dispositif qui comporte un premier substrat dont le composant principal est du dioxyde de silicium ; un second substrat dont le composant principal est le silicium ou un semi-conducteur composé ou du dioxyde de silicium ou un fluorure ; et une couche intermédiaire fonctionnelle de liaison agencée entre le premier substrat et le second substrat. Le premier substrat est lié au second substrat par la couche intermédiaire fonctionnelle de liaison par une liaison à température ambiante, une première surface du premier substrat sur laquelle une pulvérisation cathodique est effectuée étant mise en contact avec une seconde surface du second substrat sur laquelle est effectuée une pulvérisation cathodique. À ce moment, le matériau de la couche intermédiaire fonctionnelle de liaison est différent du composant principal du premier substrat et de celui du second substrat, et est sélectionné parmi des matériaux transmettant la lumière, soit un oxyde, un fluorure ou un nitrure.

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