Device and method for application of a gluing system

B - Operations – Transporting – 05 – C

Patent

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Details

B05C 9/06 (2006.01) B05C 5/02 (2006.01) B05D 1/30 (2006.01) B05D 1/34 (2006.01) B05D 1/36 (2006.01) B05D 5/10 (2006.01) B32B 7/14 (2006.01) C09J 5/04 (2006.01) C09J 5/08 (2006.01) B05C 5/00 (2006.01) C08L 61/28 (2006.01)

Patent

CA 2335374

A device for application of a gluing system of at least two components, such as a resin component and a hardener component comprising a unit of at least two hollow members (l, 2, 3, 4), at least one member for each component, provided with a number of orifices (6, 6a, 6b) in each member designed to apply the respective component onto a substrate (8) below the hollow members to form strands (10a, l0b, l0c, l0d), the hollow members being positioned above the plane of application, wherein the unit comprises means for adjusting the position of the orifices (6a) in at least one of the hollow members in relation to the position of the orifices (6b) in the other hollow member(s). The invention also relates to a method for applying a gluing system of at least two components; such as a resin component and a hardener component, in the form of strands (10a, l0b, l0c, 10d), using the device.

Dispositif servant à appliquer un système de collage composé d'au moins deux constituants, tels qu'une résine et un agent durcissant. Ce dispositif comprend un ensemble d'au moins deux éléments creux (1, 2, 3, 4), au moins un élément pour chaque constituant, chaque élément étant pourvu de plusieurs orifices (6, 6a, 6b) conçus pour appliquer le constituant respectif à un substrat (8) placé au-dessous desdits éléments creux, de manière à former des fils (10a, 10b, 10c, 10d), ces éléments creux étant positionnés au-dessus du plan d'application. Cet ensemble comporte des moyens servant à régler la position des orifices (6a) d'au moins un desdits éléments creux par rapport à la position des orifices (6b) de l'autre ou des autres éléments creux. L'invention concerne également un procédé servant à appliquer un système de collage composé d'au moins deux constituants, tels qu'une résine et un agent durcissant, sous forme de fils (10a, 10b, 10c, 10d) au moyen de ce dispositif.

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