B - Operations – Transporting – 23 – D
Patent
B - Operations, Transporting
23
D
B23D 31/00 (2006.01)
Patent
CA 2569522
The invention relates to a device for fracture splitting of an annular section (12) of a workpiece, with a housing (34) for mounting the workpiece (10), during the machining, a laser device (30), for the formation of two diametrically opposed nicks in an inner circumferential surface (16) of the annular section (12) by fusion of the material using laser energy and a fracture splitting device (32), for the fracture splitting of the annular section (12) of the workpiece (10) into two pieces along a fracturing plane (S) given by the nicks, characterised in that the laser device (30) and the fracture splitting device (32) form a single machining station and are embodied such that the formation of the nicks and fracture splitting of the workpiece (10) are carried out from opposing sides of the workpiece (10).
L'invention concerne un système pour séparer une section annulaire (12) d'une pièce par rupture. Ce système comporte un support (34) prévu pour supporter la pièce (10) pendant l'usinage, un dispositif laser (30), destiné à former deux entailles diamétralement opposées dans une surface périphérique intérieure (16) de la section annulaire (12) en ouvrant le matériau par fusion au moyen d'une énergie laser, ainsi qu'un organe de séparation par rupture (32) destiné à séparer en deux parties la section annulaire (12) de la pièce (10) par rupture le long d'un plan de rupture (S) prédéfini par les entailles. L'invention se caractérise en ce que le dispositif laser (30) et l'organe de séparation par rupture (32) constituent une station d'usinage unique et sont conçus, de façon à former les entailles et à séparer la pièce (10) par rupture à partir de côtés opposés de ladite pièce (10).
Hansch Stefan
Wisniewski Horst
Alfing Kessler Sondermaschinen Gmbh
Kirby Eades Gale Baker
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