Device and method for thermally treating substrates

H - Electricity – 01 – L

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H01L 21/324 (2006.01) G05D 23/00 (2006.01) H01L 21/00 (2006.01)

Patent

CA 2363767

The invention relates to a device and a method for thermally treating substrates, in which the substrate is heated by a heating plate. The aim of the invention is to improve the thermal homogeneity. To this end, the heating plate is heated using a number of heating elements that can be separately controlled, the temperature of the heating elements is measured and the heating process is controlled by a PID controller. In addition, the temperature of the substrate surface facing away from the heating plate is locally measured, the temperature distribution over the substrate surface is determined according to the measured temperatures and set values for the temperature of the individual heating elements are determined and transmitted to the PID controller.

Cette invention concerne un dispositif et un procédé de traitement thermique de substrats. Selon ce procédé, ledit substrat est chauffé par une plaque chauffante. Une amélioration de l'homogénéité thermique est obtenue par chauffage de cette plaque chauffante par l'intermédiaire de plusieurs éléments chauffants commandés séparément, par mesure de la température des éléments chauffants, par régulation du processus de chauffage au moyen d'un régulateur PID, par mesure locale de la température de la surface du substrat opposée à la plaque chauffante, par détermination de la distribution des températures à la surface du substrat en fonction des températures mesurées, par détermination de la valeur théorique de la température de chaque élément chauffant et par transmission de cette valeur au régulateur PID.

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