G - Physics – 01 – N
Patent
G - Physics
01
N
G01N 21/956 (2006.01) G01N 21/88 (2006.01) H05K 13/08 (2006.01)
Patent
CA 2465112
A device for inspecting solder connections between a component and a substrate or between two components or substrates, wherein the component is disposed upon the surface of the substrate, the device including an image receiving unit. An image transmitting device, the image transmitting device including a first end and a second end, the first end coupled to the image receiving unit. A tip assembly removably coupled to the second end of the image transmitting device, the tip assembly further including a mirror and an image receiving aperture, the tip assembly configured to transmit an image of the solder connections received by the mirror, through the image transmitting device, to the image receiving unit, and an illumination device, the illumination device including a light source, at least one light transmitting device, and at least one light emitting aperture disposed adjacent the image receiving aperture, the light emitting aperture directed towards the solder connections to be inspected.
L'invention concerne un dispositif permettant d'inspecter des connexions soudées entre un composant et un substrat ou entre deux composants ou substrats, le composant étant disposé sur la surface du substrat et ledit dispositif comprenant une unité de réception d'images. Un dispositif de transmission d'images comporte des première et seconde extrémités, la première extrémité étant couplée à l'unité de réception d'images. Un ensemble d'embout couplé de manière amovible à la seconde extrémité du dispositif de transmission d'images, comprend également un miroir et une ouverture de réception d'images, et il est conçu pour transmettre à l'unité de réception d'images, une image des connexions soudées reçues par le miroir, à travers le dispositif de transmission d'images. Un dispositif d'éclairage comprend une source de lumière, au moins un dispositif de transmission de lumière et au moins une ouverture d'émission de lumière disposée à proximité de l'ouverture de réception d'images, l'ouverture d'émission de lumière étant dirigée vers les connexions soudées à inspecter.
Deeth Williams Wall Llp
Delaware Capital Formation Inc.
LandOfFree
Device and methods for inspecting soldered connections does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Device and methods for inspecting soldered connections, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device and methods for inspecting soldered connections will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1749512