Device and process involving pinhole undercut area

Details Device and process involving pinhole undercut area Device and process involving pinhole undercut area

H - Electricity

01

L

H01L 49/02 (2006.01) H01L 51/10 (2006.01) H01L 51/40 (2006.01)

Patent

CA 2675083

An electronic device fabrication method including: (a) providing a dielectric region and a lower electrically conductive region, wherein the dielectric region includes a plurality of pinholes each with an entry and an exit; and (b) depositing an etchant for the lower electrically conductive region into the pinholes that undercuts the pinholes to create for a number of the pinholes an overhanging surface of the dielectric region around the exit facing an undercut area of the lower electrically conductive region wider than the exit.

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