Device for accommodating flat materials during separation by...

B - Operations – Transporting – 26 – D

Patent

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Details

B26D 7/20 (2006.01) B23K 26/42 (2006.01) B26D 7/18 (2006.01)

Patent

CA 2454622

The invention relates to a device for accommodating flat materials when separated by laser, water-jet, cutting torch or milling.The slot (3) provided under the separating device (1) is displaced by enlarging one bearing surface (15 or 15') and reducing the size of the other bearing surface (15' or 15) when the separating device is moved (1), whereby damage to the bearing surface is reduced when cutting any particular contours. The invention enables separation, targeted sorting of the separated parts and the clearing away of the remaining materials.

L'invention concerne un dispositif destiné au logement de matériaux plats en cours de sectionnement par laser, jet d'eau, chalumeau coupeur ou par fraisage. L'espacement (3) prévu sous le dispositif de sectionnement (1) est, lors du mouvement du dispositif de sectionnement (1), déplacé par l'extension d'une surface d'appui (15 ou 15') et par la diminution de l'autre surface d'appui (15' ou 15), de sorte que l'endommagement de la surface d'appui lors de la coupe d'un contour quelconque est évité. Le procédé permet de sectionner, de trier de manière ciblée les pièces coupées et de déblayer les matériaux restants.

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