Device for applying solder

Details Device for applying solder Device for applying solder

B - Operations, Transporting

23

K

32/49

B23K 3/06 (2006.01)

Patent

CA 1317758

ABSTRACT A device for applying solder to two opposite faces of an object, such as an array of conductors of a flat electrical cable, in a predetermined location, comprises a support sheet having a line of weakness along which the sheet can be folded to define two arms, each having a free end; a quan- tity of solder located on a face of each of the arms of the support sheet; and means for controlling flow of the solder, when heated, in a direction perpendicular to the line of weakness. The controlling means may be a strip of a resi- liently deformable material.

601431

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