Device for coating a substrate surface

Details Device for coating a substrate surface Device for coating a substrate surface

C - Chemistry, Metallurgy

23

C

C23C 14/30 (2006.01) C23C 14/28 (2006.01)

Patent

CA 2198983

Device containing a vacuum chamber 30 and situated therein a substrate 10 and a vaporisation crucible 22 filled with inorganic materials 24. Situated in the region of the vacuum chamber 30 is an electron beam or laser gun 26, the electron or laser beam 27 of which is directed at the crucible 22. The device is employed for coating a substrate surface 18 e.g. a plastic film with a thin coating of inorganic materials, such as e.g. silicon oxides, by vapour deposition of the inorganic materials 24. The electron or laser beam 27 of the electron beam or laser gun 26 is directed at the surface of the inorganic materials 24 in the vaporising crucible 22. The electron or laser beam 27 forms an angle .alpha. of 10 to 80° to the surface of the inorganic materials 24. On vaporising the inorganic materials 24 an overhang 25 is formed in the inorganic materials 24 and, geometrically, there is no line of sight between the vaporising inorganic materials and the substrate surface 18. The process performed in the device leads to substrates e.g. plastic films the surfaces of which exhibit no inhomogenieties such as sprayed material, particles or droplets of inorganic materials.

Appareil comportant une enceinte à vide 30 dans laquelle se trouvent un substrat 10 et un bac d'évaporation 22 rempli de matières inorganiques 24. Un canon électronique ou laser 26 est placé dans la section de l'enceinte à vide 30. Le faisceau électronique ou laser est dirigé vers le bac 22. L'appareil sert à enduire la surface d'un substrat 18 (une pellicule plastique, par exemple) d'une mince couche de matière inorganique (notamment des oxydes de silicium), en déposant par évaporation sous vide les matières inorganiques 24. Le faisceau électronique ou laser 27 du canon 26 est orienté vers la surface des matières inorganiques 24 dans le bac d'évaporation 22. Le faisceau électronique ou laser 27 forme un angle alpha de 10 à 80 degrés par rapport à la surface des matières inorganiques 24. Pendant l'évaporation, un surplomb 25 est créé dans les matières inorganiques 24 et, du point de vue géométrique, il n'existe aucune ligne de visée directe entre les matières inorganiques évaporées et la surface du substrat 18. L'appareil permet d'obtenir des substrats, par exemple une pellicule plastique, dont les surfaces sont exemptes d'inhomogénéités, notamment matière pulvérisée, particules ou gouttelettes de matières inorganiques.

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