Device for coating substrates in semiconductor manufacture

Details Device for coating substrates in semiconductor manufacture Device for coating substrates in semiconductor manufacture

B - Operations, Transporting

05

D

B05D 3/12 (2006.01) B05C 9/12 (2006.01) B05C 11/08 (2006.01) B05C 11/105 (2006.01) H01L 21/00 (2006.01)

Patent

CA 2165069

The invention concerns a device for coating substrates (20). The coating material is first applied to the substrate (20) by means of a capillary slit (21), and in a subsequent centrifuging operation the film is made uniform and reduced in thickness.

Dispositif pour le vernissage de substrats (20) dans lequel, dans un premier temps, le vernis est appliqué sur le substrat (20) par une fente capillaire (21) et, dans un deuxième temps, l'épaisseur de la couche de vernis est égalisée et réduite lors d'un processus de centrifugation.

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