Device for cooling thick-walled components, especially heat...

F - Mech Eng,Light,Heat,Weapons – 28 – F

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257/26

F28F 9/02 (2006.01)

Patent

CA 1277312

ABSTRACT OF THE DISCLOSURE The present invention relates to a device which, due to its special design, allows direct cooling of thick-walled, essentially horizontal components having different temperatures and possibly different pressures on their lower and upper surfaces. The invention especially relates to devices for cooling heat exchanger tubesheets. Extensive temperature loading of the component from the "cold side" is realized by providing closed bores in the component, e.g. tubesheet, from an upper colder side towards a lower warmer side and by inserting into each such bore a tube projecting into the bottom region or the bore and protruding beyond the colder side, the diameter of the tube being less than that of the bore.

457809

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Device for cooling thick-walled components, especially heat... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for cooling thick-walled components, especially heat..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for cooling thick-walled components, especially heat... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1288259

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.