Device for cutting and bending lead wires

Details Device for cutting and bending lead wires Device for cutting and bending lead wires

B - Operations, Transporting

21

D

153/24

B21D 21/00 (2006.01) B23D 31/00 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1223187

DEVICE FOR CUTTING AND BENDING LEAD WIRES ABSTRACT OF THE DISCLOSURE A device for cutting lead wires of an electronic circuit element mounted on a printed circuit board into a desired length and for bending the lead wires to be close to the bottom surface of the printed circuit board is capable of dealing with an electronic circuit element having three lead wires as well as that having two lead wires. The device comprises a fixed block having a stationary blade which has two side holes and a central hole formed therethrough, a pair of side levers having laterally movable blade members which are slidable on the surface of the stationary blade to cut and bend lead wires inserted through the side holes of the stationary blade, and a central lever having a movable blade member which are slidable on the surface of the stationary blade to cut and bend a lead wire inserted through the cen- tral hole of the stationary blade.

458888

Affiliated with

Also associated with

Rating

Device for cutting and bending lead wires does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for cutting and bending lead wires, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for cutting and bending lead wires will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1324996