Device for cutting lead wires

Details Device for cutting lead wires Device for cutting lead wires

B - Operations, Transporting

24

D

51/149

B24D 5/12 (2006.01) B23D 35/00 (2006.01) B23P 15/40 (2006.01)

Patent

CA 1080478

TITLE OF THE INVENTION DEVICE FOR CUTTING LEAD WIRES ABSTRACT OF THE DISCLOSURE A cutting device comprising a main body in the form of a circular disk and a hard layer provided on one surface of the main body and having a thickness of 0.02 to 0.2 mm. The hard layer is made of cemented carbides, TiC, TaC, Cr2C3, Al2O3 or the like, while the main body is made of a material, such as steel, non- ferrous metal or plastics, which is lower than the hard layer in abrasion resistance. The hard layer is formed along its outer periphery with a cutting edge which is self-sharpened when chipped.

318726

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