Device for dissipating heat from an electronic component...

Details Device for dissipating heat from an electronic component... Device for dissipating heat from an electronic component...

H - Electricity

05

K

H05K 7/20 (2006.01)

Patent

CA 2375590

To dissipate heat from a lossy electronic component which is fixed to the inside of a housing wall, several of the external and/or internal sides of the housing are placed into contact with a cooling element. In this way a large part or all of the housing surface can be used to dissipate lost heat to the surroundings.

Selon l'invention, pour permettre la dissipation de la chaleur à partir d'un composant électronique présentant des pertes, fixé sur le côté intérieur de la paroi d'un boîtier, ce dernier est mis en contact avec un corps de refroidissement par plusieurs de ses côtés extérieurs et/ou intérieurs. Ainsi, une grande partie ou la totalité de la surface du boîtier peut être utilisée pour dissiper la chaleur perdue dans l'environnement.

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