Device for forming solder connections

H - Electricity – 01 – R

Patent

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Details

H01R 4/02 (2006.01) H01R 4/72 (2006.01)

Patent

CA 2074936

A device for forming a solder connection between a plurality of electrical conductors, comprises a hollow, dimensionally heat-recoverable sleeve (1) formed for example from polyvinylidine fluoride, the sleeve having one end that is open to allow the insertion of the electrical conductors therein, and another end that is closed by a substantially spherical sealing insert.

Un dispositif permettant de réaliser un raccord soudé entre une pluralité de conducteurs électriques comprend un manchon creux thermoformable (1), par exemple en fluorure de polyvinyle, ledit manchon possédant une extrémité ouverte pour l'introduction des conducteurs électriques et une autre extrémité fermée par une garniture d'étanchéité sensiblement sphérique.

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