Device for interconnection and protection of a bare...

Details Device for interconnection and protection of a bare... Device for interconnection and protection of a bare...

H - Electricity

01

L

356/5

H01L 23/52 (2006.01) H01L 23/498 (2006.01) H01L 23/50 (2006.01) H01L 23/66 (2006.01)

Patent

CA 1301949

-19- ABSTRACT OF THE DISCLOSURE In order to interconnect an unprotected bare chip of MMIC (microwave monolithic integrated circuit), a ceramic substrate carries a double-face circuit. A network of microstrip lines which radiate from the center to the periphery is disposed on the first face of said double-face circuit. The bare MMIC chip and its microwave environment is fixed on the second face which is metallized as a ground plane. The microwave circuit is interconnected with the network of microstrips by means of plugged metallized holes. A sole-piece provided with a housing for the MMIC is fixed on the ground plane. The first face can carry self-protected components.

594548

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