B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
B29C 65/78 (2006.01) B29C 65/48 (2006.01) G11B 7/26 (2006.01) B29C 65/00 (2006.01)
Patent
CA 2374582
The aim of the invention is to provide a simple and cost-effective device for joining substrates (2, 3) which allows a secure and exact joining of the substrates and reduces the reject rate. To this end, the invention provides a novel device for joining at least two substrates (2, 3) that comprise one inner hole each and a pin that is adapted to the inner holes of the substrates. Said pin is provided with at least two noses (10) that are radially displaceable with respect to the pin (5). The edges of the inner holes of the substrates glide downwards on the straight outer surfaces of said noses (10) when said noses are displaced towards the pin.
L'objectif de la présente invention est d'obtenir un dispositif simple et économique permettant la jonction sûre et précise de substrats (2, 3) et réduisant le taux de rejet. Afin d'atteindre cet objectif, un nouveau dispositif permettant la jonction d'au moins deux substrats (2, 3) présentant chacun un orifice interne et une pointe adaptée aux orifices internes des substrats. Cette pointe présente au moins deux saillies (10) qui peuvent se déplacer de façon radiale par rapport à la pointe (5). Les bords des orifices internes des substrats glissent de haut en bas sur les surfaces extérieures droites desdites saillies (10), lorsque ces saillies se déplacent vers la pointe.
Esser Hans-Gerd
Gordt Joachim
Liedtke Bjorn
Speer Ulrich
Wise James
Robic
Steag Hamatech Ag
LandOfFree
Device for joining substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Device for joining substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for joining substrates will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1646076