Device for mounting chip-type electronic components on a...

B - Operations – Transporting – 25 – F

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B25F 1/00 (2006.01) H01L 21/00 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1164635

PHN.9699 9 ABSTRACT: A device for mounting block-shaped, plate-shaped or cylinder-shaped chip-type electronic components devoid of connection wires on a substrate, comprising a table, means for the positioning of a substrate, and a mounting head which comprises a slide which is displaceable in a guide between a loading position and an unloading position, and a suction device at the area of the unloading position of the slide. A component to be mounted dispensed from a magazine or from a strip-shaped or tape-shaped carrier is transported by the slide from the loading position to the unloading position where the component is picked up and arranged on the substrate by the suction device. As a result of the controlled displacement of the component in only two direction, accurate and reproducible positioning of the component is achieved.

371259

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