Device for providing balls or preforms for making flip-chip...

H - Electricity – 01 – L

Patent

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Details

H01L 21/48 (2006.01) H01L 21/60 (2006.01) H01L 21/68 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2348724

The invention concerns a device (14) for implementing a method for setting on a substrate (2) interconnecting balls or preforms (1) comprising the following phases: storing in bulk the preforms (1); seizing in ordered position the preforms (1) with an adapted gripping device (9); setting the preforms (1) on the substrate (2) with the gripping device (9). Said device (14) is characterised in that it consists of at least a matrix for storing the preforms, said matrix comprising a floor capable of acting as stop for the preforms when the matrix is being filled thereby enabling the implementation of a method whereby the passage from bulk storage to ordered storage is performed in masked time. The invention is useful for incorporating or replacing balls in substrates of electronic components.

The invention concerns a devise (14) for implement- ing a method for setting on a substrats (2) interconnect- ing balls or preforms (1) com- prising the following phases: storing in bulk the preforms (1); seizing in ordered posi- tion the preforms (1) with an adapted gripping devise (9); setting the preforms (1) on the substrate (2) with the gripping devise (9). Said devise (14) is characterised in that it con- sists of at least a matrix for storing the preforms, said ma- trix comprising a floor capa- ble of acting as stop for the preforms when the matrix is being filled thereby enabling the implementation of a method whereby the passage from bulk storage to ordered storage is performed in masked time. The invention useful for incorporating or replacing balls in substrates of electronic components. L'invention concerne un dispositif (14) permettant de mettre en oeuvre un procédé de dépose sur un substrat (2) de billes ou de préformes (1) d'interconnexions du type de celui assurant les phases suivantes: stockage en vrac des préformes (1), préhension en position rangée des préformes (1) par un préhenseur (9) adapté, dépose des préformes (1) sur le substrat (2) par le préhenseur (9). Ce dispositif (14) est remarquable en ce qu'il est constitué par au moins une matrice de rangement de préformes, ladite matrice comportant un font susceptible de servir de butée aux préformes lors du remplissage de la matrice permettant d'envisager la mise en oeuvre d'un procédé dont l'opération de passage d'un état de stockage en vrac à un état de stockage rangée sera réalisée en temps caché. Applications: billage ou rebillage des substrats de composants electroniques.

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