Device for removing a peduncle from a printed circuit board

H - Electricity – 05 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H05K 3/30 (2006.01) B23D 27/02 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2056184

1 ABSTRACT A device (10) for removing a connecting peduncle passing through a separation slot between two printed circuit boards comprises a moving element (13) having reciprocating motion to bring a cutting face (14) thereof which is formed under a projection projecting from a shank between a pair of bucking elements (17, 18) facing each other to identify at least in an initial section thereof a seat in which the projection is insertable without play. The transverse dimension of the moving element (13) is such as to be received in a sliding manner guided in the slot to receive said peduncle between its cutting face and the edges of the bucking elements. Upon operation of the motor means (11) the moving element (13) cuts the peduncle while the bucking elements (17,18) engage with sharpened surfaces (15,16) at the sides of the peduncle to avoid transmission of transverse strains in the printed articles to be separated.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Device for removing a peduncle from a printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for removing a peduncle from a printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for removing a peduncle from a printed circuit board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1784815

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.