Device manufactured by room-temperature bonding, device...

B - Operations – Transporting – 23 – K

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B23K 20/00 (2006.01) B81C 3/00 (2006.01)

Patent

CA 2669733

An intermediate member inducing a junction strength is provided at an interface of first substrate and second substrate, and multiple metal elements are incorporated in the layer of the intermediate member. The ratio of presence of the multiple metal elements based on the interfacial elements is 0.07 or higher attained by operating parameter at sputtering. In this manner, substrates of a poorly joinable material (for example, substrates of SiO2 material) can be joined together by cold junction at a practical junction strength to thereby obtain a device.

La présente invention concerne un élément intermédiaire conférant une force de jonction, disposé sur une interface située entre un premier et un second substrat, et de multiples éléments métalliques incorporés dans la couche de l'élément intermédiaire. Le rapport de présence des multiples éléments métalliques reposant sur les éléments d'interface est supérieur ou égal à 0,07, valeur obtenue en fixant les paramètres lors de la pulvérisation. De cette manière, les substrats en matériau difficilement liable (par exemple, des substrats à base de SiO2) peuvent être assemblés par soudure à froid, à une force de jonction pratique, afin d'obtenir un dispositif.

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