Device mounting

H - Electricity – 01 – L

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356/167

H01L 21/60 (2006.01) H01L 21/48 (2006.01) H01S 3/02 (2006.01) H01S 5/02 (2006.01)

Patent

CA 1311860

ABSTRACT A technique for assembling semiconductor devices in which semiconductor elements, especially lasers or LEDS, are mounted on a first packaging element such as a heat spreader that is mounted on a second packaging element such as a heat sink. Handling of solder preforms is avoided by coating at least one of each of the pairs of surfaces to be brought into contact with a layer of solder and heating the assembly to melt both solder layers in a single operation. In a preferred embodiment a heat spreader is coated in solder on both sides and interposed between a semiconductor element and a heat sink and the assembly is heated. Molybdenum may be used as a layer to aid wetting and adhesion and gold/tin solder may be used. Slightly different solidification temperatures and compositions for the layers may result from different take up of metallisation layers from the components into the solder.

595449

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