H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/167
H01L 21/60 (2006.01) H01L 21/48 (2006.01) H01S 3/02 (2006.01) H01S 5/02 (2006.01)
Patent
CA 1311860
ABSTRACT A technique for assembling semiconductor devices in which semiconductor elements, especially lasers or LEDS, are mounted on a first packaging element such as a heat spreader that is mounted on a second packaging element such as a heat sink. Handling of solder preforms is avoided by coating at least one of each of the pairs of surfaces to be brought into contact with a layer of solder and heating the assembly to melt both solder layers in a single operation. In a preferred embodiment a heat spreader is coated in solder on both sides and interposed between a semiconductor element and a heat sink and the assembly is heated. Molybdenum may be used as a layer to aid wetting and adhesion and gold/tin solder may be used. Slightly different solidification temperatures and compositions for the layers may result from different take up of metallisation layers from the components into the solder.
595449
Bt&d Technologies Limited
Pascal & Associates
Regnault John C.
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