Dialkylidenecyclobutane/bisimide/epoxy compositions

Details Dialkylidenecyclobutane/bisimide/epoxy compositions Dialkylidenecyclobutane/bisimide/epoxy compositions

C - Chemistry, Metallurgy

08

F

C08F 283/10 (2006.01) C08G 59/40 (2006.01) C08G 73/12 (2006.01) C08L 79/08 (2006.01)

Patent

CA 2141049

A composition comprising a 1,2-dialkylidenecyclobutane such as 1,2-dimethylenecyclobutane, a polyimide such as a bismaleimide, an epoxy resin and a curing agent for the epoxy resin can be thermally cured to a tough polymer blend having a high glass transition temperature.

Composés comprenant: un 1,2-dialkylidénécyclobutane tel qu'un 1,2-diméthylènecyclobutane, un polyimide tel qu'un bismaléimide, une résine époxide et son durcisseur, et susceptibles de donner après traitement thermique un mélange de polymères résistants présentant une température élevée de transition vitreuse.

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