C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
C22C 26/00 (2006.01) E21B 10/46 (2006.01)
Patent
CA 2703380
Diamond bonded constructions comprise a body comprising a plurality of bonded together diamond grains with interstitial regions disposed between the grains that are substantially free of the catalyst material used to initially sinter the body A metallic substrate is attached to the body, and a braze joint is interposed between the body and the substrate. The body is metallized to include a metallic material disposed along a substrate attachment surface in contact with the braze joint, wherein the metallic material is different from the braze joint material. The metallic material may exist within a region of the body extending fully or partially into the body, and/or may exist as a layer extending away from the substrate attachment surface. The body includes a working surface characterized by empty interstitial regions or by interstitial regions filled with an infiltrant material, wherein the infiltrant material is different from the metallizing material.
Belnap J. Daniel
Cariveau Peter
Voronin Georgiy
Oyen Wiggs Green & Mutala Llp
Smith International Inc.
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