Diamond composite heat sink for use with semiconductor devices

Details Diamond composite heat sink for use with semiconductor devices Diamond composite heat sink for use with semiconductor devices

H - Electricity

01

L

356/113

H01L 23/36 (2006.01) C22C 26/00 (2006.01) H01L 23/373 (2006.01)

Patent

CA 1297208

Abstract of the Disclosure A composite comprised of diamond particles embedded in a metal matrix is a highly satisfactory heat sink mate- rial for use with a semiconductor.

615077

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