Diaphragm-connected leadless package for semiconductor devices

Details Diaphragm-connected leadless package for semiconductor devices Diaphragm-connected leadless package for semiconductor devices

H - Electricity

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356/151, 356/154

H01L 23/047 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01) H05K 3/40 (2006.01)

Patent

CA 898420

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