Die attach adhesive composition

Details Die attach adhesive composition Die attach adhesive composition

C - Chemistry, Metallurgy

09

J

400/9289, 400/92

C09J 133/06 (2006.01) C03C 3/00 (2006.01) C03C 8/24 (2006.01) C08L 33/06 (2006.01) H01L 21/58 (2006.01)

Patent

CA 1324859

TITLE DIE ATTACH ADHESIVE COMPOSITION ABSTRACT OF THE INVENTION A composition for bonding integrated circuits to inorganic dielectric substrates comprising an admixture of finely divided particles of a thermally conductive metal or metal-containing compound, amorphous glass frit and fatty acid-based surfactant dispersed in a primary organic solvent selected from ethylene glycol monobutyl ether acetate, dimethyl adipate and mixtures thereof and optionally minor amounts of certain secondary solvents.

560444

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