Die attach adhesive composition

Details Die attach adhesive composition Die attach adhesive composition

C - Chemistry, Metallurgy

09

J

C09J 1/00 (2006.01) C09J 7/02 (2006.01) C09J 9/00 (2006.01) C09J 11/04 (2006.01) C09J 171/00 (2006.01) C09J 171/12 (2006.01) H01B 1/22 (2006.01) H01L 23/482 (2006.01)

Patent

CA 2041295

- 18 - TITLE DIE ATTACH ADHESIVE COMPOSITION Abstract A solid adhesive composition which is suitable for the very rapid attachment of IC chips to high surface energy substrates comprising flake silver particles dispersed in solid matrix consisting essentially of a thermoplastic phenoxy resin and a small amount of thermally crosslinkable resin. EL-0277A

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