C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 135/00 (2006.01) C08F 283/04 (2006.01) C08F 283/12 (2006.01) C08F 290/04 (2006.01) C08F 291/00 (2006.01) C08G 77/42 (2006.01) C09J 151/00 (2006.01) C09J 151/08 (2006.01) C09J 183/10 (2006.01)
Patent
CA 2343632
A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.
National Starch And Chemical Investment Holding Corporation
Norton Rose Or S.e.n.c.r.l. S.r.l./llp
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