Die attach area cut-on-fly method and apparatus

Details Die attach area cut-on-fly method and apparatus Die attach area cut-on-fly method and apparatus

H - Electricity

05

K

H05K 13/04 (2006.01) G06K 19/077 (2006.01)

Patent

CA 2660860

A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.

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