B - Operations – Transporting – 22 – F
Patent
B - Operations, Transporting
22
F
B22F 3/12 (2006.01) B22F 5/00 (2006.01)
Patent
CA 2686774
Here is disclosed a die 1 for forming a honeycomb structure provided with back pores 4 through which a forming material is introduced and slits 5 through which the forming material is extruded into a lattice-like shape, and the die comprises a first plate-like member 2 made of a super hard alloy containing tungsten carbide and a bonding agent and provided with the back pores 4 extending in a thickness direction; and a second plate-like member 2 bonded to the first plate-like member 2, made of the super hard alloy containing tungsten carbide and the bonding agent, and provided with the Slits 5 connected to the back pores 4, wherein the bonding agent is dispersed in a less amount in a bonded part 6 between the first plate- like member 2 and the second plate-like member 3 than in the other part.
Kitamura Kazumasa
Nagae Tomoki
Marks & Clerk
Ngk Insulators Ltd.
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