B - Operations – Transporting – 28 – B
Patent
B - Operations, Transporting
28
B
25/25
B28B 3/26 (2006.01) B01J 35/04 (2006.01) B28B 3/20 (2006.01) B29C 47/12 (2006.01) B29C 47/20 (2006.01)
Patent
CA 1293609
ABSTRACT A grid-shaped molding passage is formed in an outlet surface of the die body, and in an inlet surface on the opposite side plural independent supply passages are formed, which are opposite to intersecting portions of the molding passage and extend toward the outlet surface. A through hole is designed to communicate adjacent supply passages at a place that forms part of the partition wall between the supply passages and is in contact with the molding passage. This through hole takes the combined shape of a trapezoid with the width of the molding groove as its top side and the diameter of the supply passage as its maximum base side and a semicircle having the length of the base side as its diameter. This die may be used for molding catalysts or carriers, honeycomb-structured dry kneading agents or adsorbents, or organic fiber-containing ceramics and the like.
531017
Fukuda Morio
Hanada Masayuki
Inutsuka Hideo
Ogata Katsuya
Borden Ladner Gervais Llp
Catalysts & Chemicals Industries Co. Ltd.
Iwao Jiki Kogyo Co. Ltd.
LandOfFree
Die for molding honeycomb structures does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Die for molding honeycomb structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die for molding honeycomb structures will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1281494